6-Layer CuClad 217 RF PCB with 3.5mm Thick Core and ENIG Finish
1.Product Introduction: High-Performance PTFE Composite
Rogers CuClad 217 represents a premium cross-plied, woven fiberglass reinforced PTFE composite laminate, engineered to deliver the industry's lowest dielectric constant (Dk=2.17/2.20) among fiberglass-PTFE materials. This 6-layer construction utilizes a unique alternating ply orientation (90° fiberglass weave) combined with high PTFE content to achieve exceptional electrical isotropy and signal integrity for mission-critical RF applications. The material's optimized fiberglass/PTFE ratio enables faster signal propagation and superior signal-to-noise ratios compared to conventional PTFE laminates.
2.Key Material Properties
Ultra-Low Dielectric Constant: 2.17/2.20 @10GHz/1MHz
Minimal Signal Loss: 0.0009 dissipation factor @10GHz
Environmental Stability: 0.02% moisture absorption
Mechanical Reliability: 14 lbs/in peel strength
Space-Qualified: TML 0.01%, CVCM 0.01% outgassing
Thermal Performance: -55°C to +150°C operational range
3.PCB Construction Details
| Base Material | CuClad 217 / RF-27 Prepreg |
| Layer Count | 6-Layer |
| Board Dimensions | 68.45mm × 97.18mm (±0.15mm) |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.4mm |
| Via Configuration | L1-L4 Blind Vias + Through-hole |
| Finished Thickness | 3.5mm |
| Copper Weight | 1oz (35μm) all layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Green |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested prior to shipment |
4.PCB Stackup: 2-layer rigid PCB
Copper layer 1 - 35 μm
Rogers CuClad 217 Core - 1.575 mm (62mil)
Copper layer 2 - 35 μm
Bonding ply - RF-27 -0.05mm
Copper layer 3 - 35 μm
Rogers CuClad 217 Core - 0.787 mm (31mil)
Copper layer 4 - 35 μm
Bonding ply - RF-27 -0.05mm
Copper layer 5 - 35 μm
Rogers CuClad 217 Core - 0.787 mm (31mil)
Copper layer 6 - 35 μm
5.Board Statistics
Components: 31
Total Pads: 143
Thru Hole Pads: 116
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 39
Nets: 2
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Cross-Plied Construction: 90° alternating weave for uniform Dk
High PTFE Content: Lowest loss among fiberglass-PTFE laminates
Blind Via Capability: L1-L4 microvia integration
Space-Qualified: Meets NASA outgassing standards
Design Flexibility: Supports wider traces for reduced insertion loss
8.Target Applications
Radars
Electronic Countermeasures
Electronic Support Measures
Microwave Components (LNAs, filters, couplers, etc.)